Semiconductor Packaging News
TSMC's Wafer Manufacturing 2.0 Reshapes Advanced Packaging Market TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask production, redefining the advanced packaging supply chain.
Semiconductor Packaging News
In 2025, the semiconductor market is set for growth, with analysts projecting a 20% increase as demand rebounds from recent declines. Despite geopolitical and economic uncertainties, the long-term outlook remains positive across key sectors, driven by demand from emerging markets within the Internet of Things (IoT) framework. ...
Semiconductor Packaging News
TSMC Starts Equipment Installation for 2nm Fab TSMC launched its first 2-nanometer fab in Kaohsiung six months ahead of schedule, signaling robust global demand for advanced chips.
Semiconductor Packaging News Index
TSMC's Wafer Manufacturing 2.0 Reshapes Advanced Packaging Market TSMC's "Wafer Manufacturing 2.0," launched in July 2024, integrates packaging, testing, and photomask production, redefining the advanced packaging supply chain. ...
The U.S. Will Start Manufacturing Advanced Chips
1 day ago · TSMC will begin mass production at its Arizona semiconductor fab in 2025, marking a pivotal U.S. chip manufacturing milestone. The advanced facility aims to stabilize global supply chains while overcoming cultural, technical & workforce challenges under the CHIPS Act's $6.6 billion funding ...
Semiconductor Packaging News
Qualcomm's interest in Intel cools Qualcomm has paused its interest in acquiring Intel due to financial, regulatory, and operational complexities, including Intel's $50 billion debt and unprofitable semiconductor unit.
The Top 10 Semiconductor Stories of 2024
Readers are captivated by advances in semiconductor tech, from millimeter-scale laser chips slicing steel to TSMC’s bold plan for GPUs with 1 trillion transistors. Highlighting 2023’s breakthroughs, the focus remains on packing immense power into tiny spaces ...
Navigating Increased Complexity In Advanced Packaging
Engineers are revolutionizing semiconductor packaging with AI-driven tools, metrology, and simulation to tackle variability. By integrating complex materials and assemblies, they ensure precise alignment, thermal management, and reliable yields for cutting-edge devices ...
Wafer Shipments Remain Soft in 2024 Before Strong Expected …
Global silicon wafer shipments are projected to decline by 2% in 2024 but will rebound with a 10% growth in 2025. Rising demand for AI and advanced processing, along with new applications in packaging and memory, will drive growth through 2027 ...
Advanced Packaging Driving New Collaboration Across Supply Chain
The semiconductor industry's shift to advanced packaging, including chiplets and heterogeneous integration, fuels innovations in AI, 5G, and automotive fields. Industry leaders stress that collaboration is crucial to meet performance demands and tackle complex challenges ...