Manufacturing is something the semiconductor industry wanted to forget about for decades. It’s now front and center and ...

Rigorous testing is still required, but an abstraction layer can significantly reduce errors in the fab while optimizing ...

This paper studies board level reliability for surface mount devices during thermal cycling, while specifying failure modes and locations. Failure modes are characterized using thermal warpage and ...

The rapid advancement of technologies like artificial intelligence (AI) and the Internet of Things (IoT) has heightened the ...

Imagine you're cooking. You're trying to develop a unique flavor by mixing spices you've never combined before. Predicting ...