Infineon Technologies AG announces its 200 mm silicon carbide (SiC) manufacturing capability, with initial product releases ...

Silicon Carbide (SiC) Wafer Market is Segmented by Type (4 Inch, 6 Inch, 8 Inch), by Application (Power Device, Electronics & Optoelectronics, Wireless Infrastructure). The Silicon Carbide (SiC ...

According to Infineon's press release, the company is advancing its 8-inch silicon carbide (SiC) technology, having released ...

Silicon Carbide (SiC) Wafer Market is Segmented by Type (4 Inch, 6 Inch, 8 Inch), by Application (Power Device, Electronics & Optoelectronics, Wireless Infrastructure). The Silicon Carbide (SiC) Wafer ...

Silicon Carbide (SiC) Wafer Market is Segmented by Type (4 Inch, 6 Inch, 8 Inch), by Application (Power Device, Electronics & Optoelectronics, Wireless Infrastructure). BANGALORE, India ...

GlobalWafers chairperson Doris Hsu reports that prices for mainstream 6-inch silicon carbide (SiC) substrates have stabilized ...

The release to customers of the first SiC products based on the 200-millimeter wafer technology will be a substantial step forward in Infineon’s SiC roadmap, with a strong focus on providing customers ...

Infineon Technologies has announced significant progress along its 200 mm SiC roadmap, with customers receiving the first ...

The introduction of the first SiC products utilizing 200-millimeter wafer technology represents a major milestone in Infineon’s SiC roadmap. The company remains committed to offering a diverse ...