From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer ...

As a result, test systems struggle to keep up. “A wafer contains over 100,000 signal pins, which are getting smaller and more densely packed. This makes designing a probe card extremely challenging, ...

Wafer testing is conducted using Automatic Test Equipment (ATE) along with test infrastructures such as the Prober Interface Board (PIB), signal tower, and probe card. In this paper, we present the ...

HARRISBURG, PA – Cumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to expand its product portfolio with the ...

The Single Die Alignment feature makes it possible to automatically probe a wafer with inconsistent die to die spacing, or rotationally misaligned die, without having to make any manual adjustments.” ...