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Chip startup Graphcore Ltd. today introduced a new artificial intelligence processor, the Bow IPU, that uses an innovation dubbed wafer-on-wafer technology to speed up calculations. U.K.-based ...
Wafer cleaning, once a rather mundane task as simple as dipping wafers in cleaning fluid, is emerging as one of the top major engineering challenges for manufacturing GAA FETs and 3D-ICs. With these ...
Wafer-to-wafer bonding is an essential process step to enable 3D devices such as stacked DRAM, memory-on-logic and future CMOS image sensors. At the same time, minimizing the dimensions of TSVs, which ...
Entegris, Inc., a leader in contamination control and materials handling technologies for highly demanding advanced manufacturing environments, and imec, a world-leading research center in ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Tessera Technologies, Inc. (Nasdaq:TSRA), announced today that its wholly owned subsidiary Invensas Corporation will exhibit its low temperature wafer bonding and 3D ...
Taiwan Semiconductor Manufacturing Company Ltd (TSMC), the world’s largest chip contract manufacturer in the world is announcing their new 3D stacking technology called Wafer-on-Wafer (WoW). This ...
As semiconductor technology scales down in size, process integration complexity and defects are increasing in 3D NAND flash, partially due to larger stack deposits and thickness variability between ...
YMTC, a Chinese 3D NAND maker, is not only ramping up production of flash memory at a rapid pace, but does so using silicon wafers produced in China, according to chief executive and chairman of Sumco ...
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