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Chip startup Graphcore Ltd. today introduced a new artificial intelligence processor, the Bow IPU, that uses an innovation dubbed wafer-on-wafer technology to speed up calculations. U.K.-based ...
Wafer cleaning, once a rather mundane task as simple as dipping wafers in cleaning fluid, is emerging as one of the top major engineering challenges for manufacturing GAA FETs and 3D-ICs. With these ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Tessera Technologies, Inc. (Nasdaq:TSRA), announced today that its wholly owned subsidiary Invensas Corporation will exhibit its low temperature wafer bonding and 3D ...
Wafer-to-wafer bonding is an essential process step to enable 3D devices such as stacked DRAM, memory-on-logic and future CMOS image sensors. At the same time, minimizing the dimensions of TSVs, which ...
Taiwan Semiconductor Manufacturing Company Ltd (TSMC), the world’s largest chip contract manufacturer in the world is announcing their new 3D stacking technology called Wafer-on-Wafer (WoW). This ...
As semiconductor technology scales down in size, process integration complexity and defects are increasing in 3D NAND flash, partially due to larger stack deposits and thickness variability between ...
PLAINVIEW, N.Y., June 13, 2018 (GLOBE NEWSWIRE) -- Veeco Instruments Inc. (NASDAQ:VECO) today announced that Aledia, a developer and manufacturer of next-generation 3D LEDs for display applications ...
“This order from one of the largest Chinese foundries further cements EV Group's position as the market and technology leader in wafer bonding for leading-edge applications,” stated Hermann Waltl, ...
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