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EV Group to showcase temporary wafer bonding for HBM & 3D DRAM in Korea
Source: EV Group. According to Dr. Thorsten Matthias, regional sales director Asia/Pacific for EV Group, “Accelerating the ...
AMD Closing Competitive GPU Gap With Nvidia, Gains Market Share From Intel In Client And Server Markets: Analyst
AMD remains a strong buy with a $170 target price, thanks to its strong position in AI market, market share gains and ...
TSMC now said not to be eyeing up Intel's fabs while other rumours suggest Intel could be split between TSMC and Broadcom
Meanwhile, another WSJ report doubles down on the idea of TSMC taking over Intel's fabs and adds Broadcom into the mix. The idea is that Broadcom would be interested in acquiring Intel's chip design ...