A new technical paper titled “Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies” was published by researchers at Arizona State University. Abstract ...

And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

Renesas Electronics has introduced the RA4L1 microcontroller (MCU) group, including 14 new devices with ultra-low power ...

Aehr is now the only company offering both wafer-level and package-level test and burn-in solutions for AI processors. Gayn Erickson, President and CEO of Aehr Test Systems remarked: "With this ...

Meanwhile, there are other relative newcomers in fan-out, namely from China. For example, Jiangyin Changdian Advanced Packaging (JCAP) has a wafer-level package. JCAP is part of Jiangsu Changjiang ...

Aehr Test Systems, Inc. (NASDAQ:AEHR) is a leading designer, manufacturer, and seller of test and burn-in products for semiconductor devices in the wafer level, singulated die, and package part ...

We recently published a list of 10 AI Stocks on Wall Street’s Radar. In this article, we are going to take a look at where Aehr Test Systems, Inc. (NASDAQ:AEHR) stands against other AI stocks on ...