A new technical paper titled “Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies” was published by researchers at Arizona State University. Abstract ...

And here we’ve been complaining about Flat Pack No-Lead chips when this guy is prototyping with Ball Grid Array in a Wafer-Level Chip Scale Package (WLCSP). Haven’t heard that acronym before?

Aehr is now the only company offering both wafer-level and package-level test and burn-in solutions for AI processors. Gayn Erickson, President and CEO of Aehr Test Systems remarked: "With this ...

Meanwhile, there are other relative newcomers in fan-out, namely from China. For example, Jiangyin Changdian Advanced Packaging (JCAP) has a wafer-level package. JCAP is part of Jiangsu Changjiang ...

Aehr Test Systems, Inc. (NASDAQ:AEHR) is a leading designer, manufacturer, and seller of test and burn-in products for semiconductor devices in the wafer level, singulated die, and package part ...

Under MMSP’s Contract Package 103, constructed by Sumitomitsui Construction, four TBMs will be utilized for the tunnelling of ...

We recently published a list of 10 AI Stocks on Wall Street’s Radar. In this article, we are going to take a look at where Aehr Test Systems, Inc. (NASDAQ:AEHR) stands against other AI stocks on ...