With today's chips packing more power into smaller footprints, getting them from fab to factory now demands a new level of ...

SK hynix to reportedly change wafer cutting for its next-gen HBM4 memory and 400-layer NAND flash, as they're becoming ...

Defect detection requirements on the order of 10 defective parts per million (DPPM) are driving improvements in inspection ...

Innoscience, a leading Chinese GaN specialist, plans to expand its monthly production of 8-inch (200mm) wafers from 13,000 to ...

While Intel, AMD, and Nvidia focus on performance and AI training, IBM doubles down on reliability, cyber defense, and AI ...

L&T Semiconductor Technologies on Tuesday said it will collaborate with IBM on processor technology development. The partnership will look to advance the design of processors for crucial ...

Korean memory chipmaker SK Hynix has adopted the Metron 3D 300 mm in-line wafer metrology system from Infinitesima. SK Hynix will use the technology in volume production as it provides 3D process ...

Kukkal joined the Si2 board in 2020 and assumed the chair role in 2022. Before NXP, he held executive leadership and ...