With today's chips packing more power into smaller footprints, getting them from fab to factory now demands a new level of ...

SK hynix to reportedly change wafer cutting for its next-gen HBM4 memory and 400-layer NAND flash, as they're becoming ...

Monday September 16, 2013 Written by Vidhyanshu Two consortiums, including IBM and STMicroelectronics, have proposed building semiconductor wafer plants in India costing a total of $8 billion.

Tech giant IBM and Japan’s electronics company Tokyo Electron (TEL) have renewed their partnership to advance semiconductor technologies for the next five years. The collaboration will focus on ...

Innoscience, a leading Chinese GaN specialist, plans to expand its monthly production of 8-inch (200mm) wafers from 13,000 to ...

For years, IBM, TEL, and others have worked together to build the most advanced public-private semiconductor research facility to accelerate chip innovation.

IBM is currently manufacturing Xilinx's flagship VirtexX-II Pro semiconductor products using a 130nm process on 200mm wafers at IBM facilities in Burlington, Vt. and on 300mm wafers at facilities in ...

ClassOne Technology Signs JDA with IBM Research ClassOne and IBM to jointly develop innovative solvent solutions for advanced semiconductor and packaging process applications.

The project, for which Tata Semiconductor and Tower are in the race, includes identifying the upgrades needed to improve the ...