Working arrays were cut from the wafer and mounted in a lead frame, bonded with gold wires, and fiat lux. The whole thing must have been a great experience in modern fab methods, and [emach1ne ...
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TSMC takes 'chip binning' to a whole new level as entire wafer 'found in a dumpster'While it's not the most advanced fab in the world ... Instead it's a test wafer containing dummy circuitry layouts used to evaluate the performance and calibration of the hyper-complex lithography ...
Many companies, DRAM and NAND flash suppliers in particular, have become much more active with new fab construction and expansion projects at existing fabs. This surge in activity comes after four ...
These companies offer the types of ICs that benefit most from using the largest wafer size available to best amortize the manufacturing cost per die. Moreover, they have the means to continue ...
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