The turning point for equipment connectivity arrived around 2000 with the industry’s transition to 300mm wafers. The sheer ...

FUJIFILM Corporation announced the launch of “ZEMATES™*1,” a new brand of photosensitive insulating materials for semiconductor back-end processes, centered on polyimide*2. The ZEMATES™ brand reflects ...

Introducing its end-to-end product portfolio and cutting-edge technologies that address customer challenges!Tokyo, Japan, ...

Taiwan Semiconductor Manufacturing Company (TSMC) is embarking on a significant scaling of its most sophisticated manufacturing capabilities. This strategic ...

Imec has achieved the first successful wafer-scale fabrication of solid-state nanopores using EUV lithography on 300mm wafers ...

ASML’s new hyper-na euv machines are a huge step forward, letting us make chips with features smaller than 2 nanometers, ...

One Arizona school district's career and technical education program exposes student to the semiconductor industry's ...

A sub-class of Si spin qubits uses metal-oxide-semiconductor (MOS) quantum dots to confine the electrons, a structure that ...

With copper interconnects facing limitations amid growing AI data workloads, silicon photonics - using light to transmit data - is developing rapidly to support the ultra-high bandwidth, low latency, ...

Robotics in Semiconductor Market generated USD 8.2 bn in 2024 and is projected to grow from USD 90 bn in 2025 to USD 20.1 bn ...

Taiwan Semiconductor Manufacturing Company benefits from unchallenged process node leadership and robust AI-driven demand.

The company is aiming to produce its first silicon wafers by 2028 and have its first commercial system online by 2029.