Global Semiconductor Manufacturing Industry Reports Solid Q4 2024 Results, SEMI Reports
The global semiconductor manufacturing industry closed 2024 with strong fourth quarter results and solid year-on-year (YoY) ...
Park Systems Corp.: Park Systems Expands FX Large Sample AFM Lineup to Power Next-Gen Industrial Innovation
Park Systems, a global leader in atomic force microscopy (AFM), has unveiled an expanded FX Large Sample AFM series at SEMICON Korea 2025. Building ...
Digi Times1h
SK Hynix taps VP to lead US HBM packaging facility
Lee to head its newly established semiconductor packaging facility in the US. His leadership will be closely watched as the company navigates intensifying market competition.
Business Wire20h
ASE Expands its Chip Packaging and Testing Facility to Enable Next-Gen Applications
ASE has officially launched its fifth plant in Penang, which will significantly build on the company’s strong packaging and ...
Park Systems Expands FX Large Sample AFM Lineup to Power Next-Gen Industrial Innovation
Park Systems, a global leader in atomic force microscopy (AFM), has unveiled an expanded FX Large Sample AFM series at ...
CAMTEK TO APPOINT AN EXECUTIVE CHAIRMAN
Camtek Ltd (NASDAQ: CAMT) (TASE: CAMT), announced today that its Board of Directors nominated Lior Aviram as Executive ...
Compoundsemiconductor.net15h
Infineon tackles GaN package standards
GaN suppliers have taken various approaches to packaging, leading to a lack of multiple footprint-compatible sources for ...
AZoM on MSN22h
Hamamatsu Launches Compact InGaAs Photodiode with Ceramic Packaging and Easy Integration
Hamamatsu Photonics is pleased to announce the launch of its latest InGaAs Photodiodes (PD) series designed for longer ...