VTT Technical Research Centre of Finland reports that the Chips Joint Undertaking's Public Authorities Board will award ...

The Public Authorities Board of the Chips Joint Undertaking (EU Chips Act) awards new funding to the APECS pilot line.

According to Siemens, and in collaboration with TSMC, it has delivered a certified Xpedition Package Designer automated ...

The VTT Technical Research Centre of Finland has been awarded €29 million of EU Chips Act money for chip packaging ...

Siemens Digital Industries Software readied an automated workflow for high-performance TSMC wafers for mobile and other ...

Source: EV Group. According to Dr. Thorsten Matthias, regional sales director Asia/Pacific for EV Group, “Accelerating the ...

AI-driven automation, tighter design-test collaboration, and evolving BiST techniques are redefining DFT strategies.

Insights from HiCONNECTS: Summary HiCONNECTS is advancing Europe's semiconductor ecosystem through heterogeneous integration. Wit ...