The semiconductor industry is under increasing pressure to adopt sustainable practices. Advanced packaging technologies can ...

Heterogeneous integration and packaging technologies are at the forefront of modern electronics, enabling the combination of different materials and components into a single package to enhance ...

Michael Kelly, vice president of advanced packaging development and integration at Amkor, sat down with Semiconductor Engineering to talk ... that’s pulling all the pieces together, making these ...

High-end performance packages with 2.5D/3D approaches are used today to package AI processors like GPUs, and AI ASICs, as ...

As the semiconductor industry increasingly moves to chiplets, 2.5D/3D packaging, and heterogeneous integration, there are significant new challenges for test. Leaders like Teradyne have the ...

Intel Foundry also was first to report a 100x 2 throughput improvement using a heterogeneous integration solution for advanced packaging ... the roadmap for the semiconductor industry.

boxcs - adobe.stock.com This technology is applicable to heterogeneous integration, which enables the integration of various types of semiconductor devices, such as analogue ICs. The two companies ...

Their insights underscored emerging technologies driving high-performance computing and advanced system integration. Semiconductor Engineering Read the Full Article The dedicated team at Semiconductor ...