Researchers from Lam Research, the University of Colorado Boulder, and Princeton Plasma Physics Laboratory (PPPL) investigated ways to speed up the cryogenic reactive ion etching process for 3D NAND ...
The team has just determined that its approach – involving plasma nitridation of the SiC surface, sputter deposition of SiO 2, and post-deposition annealing – reduces the interface state density near ...
Laser Thermal Laboratory, Department of Mechanical Engineering, University of California, Berkeley, California 94720, United States ...
As a global leader in wafer fabrication equipment and services for the semiconductor industry ... Lam continues to drive breakthroughs in etch and deposition technology to enable the manufacturing ...
Semiconductor manufacturing is going through massive transformational challenges driven by strong demand for advanced computing, fueled by AI, cloud, the electrification of the economy, and the need ...
Over many decades, plasma power delivery has evolved alongside semiconductor devices to improve etch uniformity. To achieve angstrom-scale geometries, it will be essential to generate plasmas with ...
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