The US, China and Japan are working on research and development in gallium oxide crystal growth and productionizing gallium oxide chips. The Gallium oxide ...

A new technical paper titled “Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies” was published by researchers at Arizona State University. Abstract ...

EffiTrap is a state-of-the-art 4D defect characterisation platform designed to address critical quality control challenges in semiconductors and multilayer devices, which are used in smartphones, ...

Nature Research Intelligence Topics enable transformational understanding and discovery in research by categorising any document into meaningful, accessible topics. Read this blog to understand ...

Delamination occurs when there is a mismatch in coefficients of thermal expansion (CTE) between the encapsulate materials, such as the mold compound used to encapsulate the semiconductor chip and the ...