Researchers are investigating hole mobility in compressively strained germanium on silicon to improve the performance of next ...
Researchers believe they can fit 25 million Josephson junctions — a useful component for quantum computing — on one two-inch ...
FUJIFILM Corporation today announced the successful completion of a new building for development and evaluation at the ...
Organic light-emitting diodes (OLEDs) power the high-end screens of our digital world, from TVs and phones to laptops and ...
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Semiconductor and IC Packaging Materials Market Size, Trends, Segments, Share and Companies 2025-35
According to projections from Towards Packaging, the global semiconductor and IC packaging materials market is set to increase from USD 53.48 billion in 2026 to nearly USD 114.28 billion by 2034, ...
Quantum Materials Market to Hit USD 96.9 Billion by 2032 as the Race for Quantum Computing, Next-Gen Semiconductors, and Topological Electronics Accelerates Globally ...
Researchers have developed a new quantum material based on germanium and silicon, that conducts electricity with almost no ...
Scientists at the University of Warwick and the National Research Council of Canada have achieved and measured the highest ...
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Record-setting charge mobility in germanium-silicon material points to energy-saving quantum chips
Most modern semiconductors are fabricated of or on silicon (Si), but as devices get smaller and denser, they dissipate more ...
Chinese researchers develop a direct wafer bonding method for 2D semiconductors, enabling smaller, faster electronics.
A key objective of electronics engineers is to further reduce the size of devices, while also boosting their speed, ...
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