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Improved formula predicts energy barriers in 2D chips, aiding ultra-scaled device development

A research team affiliated with UNIST has made a significant breakthrough in overcoming one of the most persistent challenges hindering the commercialization of two-dimensional (2D) semiconductor ...
Business Wire

CDimension Launches to Tackle Hardware Bottlenecks from the Ground Up, Beginning with Commercial 2D Materials Release

Debut of ultra-thin materials delivers up to 1,000× energy efficiency improvements, a foundational step toward vertically integrated chips that unify compute, memory, and power SAN JOSE, ...

Sivers Semiconductors and Doosan Partner to Develop Leading-Edge Ka-Band SATCOM Antenna Panels

Collaboration aims to advance scalable electronically steerable array (ESA) technology for Korea's strategic satellite communications ecosystemKISTA, Sweden, Nov. 25, 2025 /PRNewswire/ -- Sivers ...