designed to transform the semiconductor landscape with innovative multi-chiplet designs. This UCIe chiplet brings highly customizable, package-level integration with die-to-die interconnect and ...
Summary The UCIe standard, launched in 2022, enhances die-to-die connectivity for multi-die systems. Synopsys' Manuel Mota recently compared UCIe Standard and Advanced in a webinar, highlighting its ...
A technical paper titled “Measuring electrical properties in semiconductor devices by pixelated STEM and off-axis electron holography (or convergent beams vs. plane waves).” was published by ...
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