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Improved formula predicts energy barriers in 2D chips, aiding ultra-scaled device development
A research team affiliated with UNIST has made a significant breakthrough in overcoming one of the most persistent challenges ...
STERLING, Va.–Intrinsic Semiconductor Inc. Tuesday (May 4) said it has begun selling silicon carbide (SiC) wafer products for use in microelectronic devices. Key products offered are insulating and ...
ETRI succeeds in the development of a p-type semiconductor material to lead semiconductor innovation
A group of Korean researchers have recently succeeded in developing new p-type semiconductor materials and thin-film transistors that will lead the innovation of the semiconductor industry. These new ...
Tech Xplore on MSN
Direct approach can bond and debond 2D semiconductors without any glue-like materials
A key objective of electronics engineers is to further reduce the size of devices, while also boosting their speed, performance and efficiency. Two-dimensional (2D) semiconductors, single-layer and ...
Self-heating effects (SHE) in advanced semiconductor devices have emerged as a critical phenomenon influencing reliability and performance. As device dimensions shrink and power densities increase, ...
Wafer-scale transfer of 2D materials by bonding–debonding. a, Schematic illustration of the bonding and debonding process. b, ...
Offering four and six MOSFETs, respectively, in the low profile MAACPAK PressFit package, the Vishay Semiconductors ...
This course introduces basic concepts of the quantum theory of solids and presents the theory describing the carrier behaviors in semiconductors. The course balances fundamental physics with ...
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