The rapid evolution of wide band gap (WBG) power electronics, particularly SiC and GaN-based devices, demands advanced packaging materials capable of ...

Researchers engineered a strained germanium layer on silicon that allows charge to move faster than in any silicon-compatible ...

Offering four and six MOSFETs, respectively, in the low profile MAACPAK PressFit package, the Vishay Semiconductors ...

ASML has undergone four stock splits in its public life, with the most recent being an 8-to-9 split in October 2007. While ...

Wondering if Analog Devices is a bargain or priced for perfection? You are not alone. We are about to break down what the ...

Infineon Technologies AG is navigating a challenging macro environment, aiming to expand in AI and data center markets. See ...

Chinese researchers develop a direct wafer bonding method for 2D semiconductors, enabling smaller, faster electronics.

Wafer-scale transfer of 2D materials by bonding–debonding. a, Schematic illustration of the bonding and debonding process. b, ...

A key objective of electronics engineers is to further reduce the size of devices, while also boosting their speed, performance and efficiency. Two-dimensional (2D) semiconductors, single-layer and ...

Semiconductors are the core of modern electronics—from smartphones and laptops to solar panels and cars. This video explains how semiconductors work, including concepts like band gaps and doping, in a ...

Nov 21 (Reuters) - Leather goods maker China International Development Corp (0264.HK), opens new tab said on Friday it is exploring the acquisition of Lonten Semiconductor Co Ltd for up to HK$9 ...