Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...

[Left] The schematic shows the multi-functions of the 2D-WS2 bottom interfacial layer for interface stability and the vertically well-ordered domain structures of HZO, which leads to excellent ...

Capacitance-voltage (C-V) testing is widely used to determine semiconductor parameters, particularly in MOSCAP and MOSFET structures. However, other types of semiconductor devices and technologies ...

Nissan Motor has been granted a patent for a semiconductor device with a unique structure. The device includes drift, well, and source regions with varying impurity concentrations, allowing for ...

After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor ...

A new publication from Opto-Electronic Advances; DOI 10.29026/oea.2025.240159, discusses on-chip light control of semiconductor optoelectronic devices using integrated metasurfaces. Since the initial ...

Hamamatsu Photonics has developed the HyperGauge thickness measurement system C17319-11, a new device designed to enhance ...

With the semiconductor industry moving toward 3D DRAM, 3D logic architectures, and 1000+ layer 3D NAND stacks, 1 mechanical failures may become more common. Due to the complexity of these structures, ...

Single event burnout (SEB) represents a critical failure mode in power semiconductor devices, whereby the impact of a single energetic particle – often encountered in space or high-radiation ...

L&T Semiconductor Technologies (LTSCT), a wholly owned subsidiary of Larsen & Toubro, has announced an IP License Master Agreement with Andes Technology, a leading provider of RISC-V Processor IPs.

It is hard to pinpoint the number of stops that electronic devices make before reaching their final consumer. For most phones ...