Skoltech researchers and their colleagues from Ludwig Maximilian University of Munich, Germany, Nanjing University of China, ...
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Self-powered photodetector achieves 20-fold sensitivity boost using novel device structure
Silicon semiconductors used in existing photodetectors have low light responsivity, and the two-dimensional semiconductor MoS₂ (molybdenum disulfide) is so thin that doping processes to control its ...
Capacitance-voltage (C-V) testing is widely used to determine semiconductor parameters, particularly in MOSCAP and MOSFET structures. However, other types of semiconductor devices and technologies ...
Toyoda Gosei has developed a semiconductor device with reduced contact resistance in the body electrode without affecting channel mobility. The device features a unique two-layer p-type structure and ...
Major processes in semiconductor wafer fabrication: 1) wafer preparation, 2) pattern transfer, 3) doping, 4) deposition, 5) etching, and 6) packaging. The process of creating semiconductors can be ...
Dr. Yong-Hun Kim from the Energy & Environment Materials Research Division and Dr. Kyung Song from the Material Characterization Center, in collaboration with Professor Hyun-Sang Hwang's team from ...
Single event burnout (SEB) represents a critical failure mode in power semiconductor devices, whereby the impact of a single energetic particle – often encountered in space or high-radiation ...
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New semiconductor etching process achieves five-fold speed improvement
After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor etching method that achieves etch rates up to five times faster than ...
Nuvoton Technology Corporation Japan (hereinafter "NTCJ") announced on January 20 the start of mass production of its high-power ultraviolet semiconductor laser (379 nm, 1.0 W), which delivers ...
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