A new technical paper titled “Scanning electron microscopy-based automatic defect inspection for semiconductor manufacturing: a systematic review” was published by researchers at KU Leuven and imec.
Attending the RAISe+ Scheme Signing Ceremony are Professor Chen Fu-Rong (2nd left) and his research team members: Professor Hsueh Yu-Chun (1st left), Dr Chen Yan (2nd right) and Mr Chen Yuchi (1st ...
UC Santa Barbara researchers have achieved the first-ever "movie" of electric charges traveling across the interface of two different semiconductor materials. Using scanning ultrafast electron (SUEM) ...
They can image a wide range of materials and biological samples with high magnification, resolution, and depth of field, thereby revealing surface structure and chemical composition. Industries like ...
Key components that semiconductor manufacturers must consider in advanced packaging. Challenges in advanced packaging, particularly in defect analysis and die-level fault isolation. New technologies ...
Classification and Localization of Semiconductor Defect Classes in Aggressive Pitches (imec, Screen)
A new technical paper titled “An Evaluation of Continual Learning for Advanced Node Semiconductor Defect Inspection” was published by Imec and SCREEN SPE Germany. “Deep learning-based semiconductor ...
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