Researchers at Columbia Engineering have for the first time used DNA to help create 3D electronically operational devices ...

Hundreds of millions of pounds are set to turbocharge the manufacturing sector in Wales as Chancellor Rachel Reeves visited ...

Achieving integration of semiconducting and superconducting qubits with full industrial 300-mm wafer fabrication.

New reports on U.S. IC chemicals and materials availability; China export blacklist expands; global fab equipment report; ...

Gstar has marked a significant milestone with the shipment of its first batch of core equipment for its new photovoltaic manufacturing facility in Indonesia. The shipment includes monocrystalline ...

A new solid-state laser produces 193-nm light for precision chipmaking and even creates vortex beams with orbital angular ...

Jiufengshan Laboratory (JFS) announced two major breakthroughs in GaN technology: the world's first 8-inch silicon-based ...

With self-developed chips Apple will reduce its dependence on third-party suppliers, thereby reducing component costs and ...

TL;DR: Intel announced Lip-Bu Tan as CEO and achieved a milestone by testing its 18A process node wafers at its Arizona fab, marking a significant step for U.S. semiconductor manufacturing.

Infineon will supply bare semiconductor wafers to CDIL, which the Indian firm will process and use for assembly and packaging to make power chipset for use in products like power inverters, solar ...