As electronic systems grow increasingly complex and energy-intensive, traditional power management methods — centered on centralized systems and external components — are proving inadequate. The next ...

Soitec's photonics wafers are used for data center optical interconnections as higher communication speeds are needed. Soitec's manufacturing technology seems to be the only efficient and reliable way ...

The core material used in the proprietary QST substrate is a ceramic poly-aluminum nitride (poly-AlN), covered by several encapsulation layers on top of which is a silicon dioxide (SiO 2) bonding ...

ASML CEO signals US advantage as China faces 10~15 year gap in advanced chip technology. Christophe Fouquet, CEO of ASML, ...

Infineon Technologies AG announces its 200 mm silicon carbide (SiC) manufacturing capability, with initial product releases ...

Infineon Technologies has announced significant progress along its 200 mm SiC roadmap, with customers receiving the first ...

SemiQ Inc, a US SiC company, has announced the QSiC 1200V MOSFET, a third-generation device that shrinks die size while ...

The diodes deliver high temperature operation to 175° C and a positive temperature coefficient for easy parallelling.

Revenue for Q4 2024 was $252 million, with earnings per diluted share of $1.54. The CEO highlighted strong demand in CS&I sales, which were the main driver of better-than-expected margins and EPS.