Plasma pens can be seamlessly integrated into existing inline processes with varying degrees of automation. This flexibility ...

The European Commission has approved funding under the European Chips Act for Infineon's Smart Power Fab in Dresden, bringing ...

A technical paper titled “Buried power rail to suppress substrate leakage in complementary field effect transistor (CFET)” ...

SemiQ Inc, a developer of SiC devices, has announced a family of three 1200V SiC full-bridge modules, each integrating two of ...

Cash dividends for Class A and Class B common shares are payable on May 1, 2025 to shareholders of record on April 15, 2025. Bel currently has approximately 12,540,000 common shares outstanding, of ...

Impulse, the innovator behind the world’s first high-performance battery-integrated cooktop, is expanding its vision. Alongside a strategic partnershi ...

Keystone Electronics' compact SMT PCB edge connectors feature a horizontal orientation, making them well-suited for parallel board-to-board or board-to-component power or signal transfer.

Dynolt Technologies will use the funding to enhance e-mobility with high-power fast chargers and expand into solar and ...

ASU's new R&D facility is a key component of America's plan to bolster semiconductors and high-tech manufacturing.

INGLESIDE, IL – IDENTCO, a manufacturer of high-performance labels for the power equipment, electronics, transportation, and the general industrial sector, has launched an online storefront offering a ...

A team of German researchers has developed a miniaturized solar cell experiment for nanosatellites. It was used to test ...

This minuscule, surface-mount GDT has a relatively lower-voltage sparkover threshold in an EIA 1206-size package to provide ...