Toyota and Mapbox are extending their technology partnership to support Toyota's next-generation in-vehicle navigation ...

The 3D-IC market outlook is entering a decisive phase as the semiconductor industry transitions beyond the limits of traditional Moore’s Law scaling. As performance, power efficiency, and system ...

We've known for a while that this feature was coming, but Google has finally pressed the go-ahead for the power-saving mode in Google Maps on Pixel 10 phones. Before I delve into more details, there's ...

I’m already loving this device, and I haven’t even touched one. Arduino announced it has collaborated with M5Stack to develop the new compact and powerful Nesso N1 IoT development kit. This system ...

Shortly before the Call of Duty: Black Ops 7 beta began in October 2025, Treyarch detailed how the next entry in the storied first-person shooter series will be following a three-lane map design ...

The current UI for Memory Map is functional but lacks a polished and modern design. While the core features work, the user experience can be significantly improved with better visual design, layout ...

As we’ve been discussing recently, the “little details” about game design can absolutely make or break how much gamers love certain titles. When there are key “lapses in judgment” with things like ...

Fan-out wafer-level packaging (FOWLP) is becoming a critical technology in advanced semiconductor packaging, marking a significant shift in system integration strategies. Industry analyses show 3D IC ...

Funding from the U.S. National Science Foundation is part of a broader push to propel domestic computer chip manufacturing A $3 million grant from the U.S. National Science Foundation (NSF) to the ...