NXP’s New i.MX 93W Fuses Edge Compute and Secure Wireless Connectivity to Accelerate Physical AI

First applications processor to combine an AI NPU with secure, tri-radio connectivity, replacing up to 60 discrete components ...

Toyota's Denso bids for chipmaker Rohm in potential $8.3 billion deal

Toyota supplier Denso has made a bid ‌for chipmaker Rohm , a potential $8.3 billion deal that will expand the auto parts giant's hold on power management chips used in electric vehicles and data ...

Mike Kappes

Mike Kappes is Founder and CTO of NEXT Semiconductor, leading custom integrated circuit innovation for autonomous vehicles and space communications. With 20+ years in semiconductors, he previously ...
IEEE

Constant Current and Voltage Charging for Wireless Charging Systems Based on an Ultra-simple Secondary Side Integrated Rectifier and Power Adjustment Circuit

Abstract: Aiming to achieve a compact receiver for wireless charging systems (WCSs), this letter proposes an integrated rectifier and rower adjustment (IRPA) circuit, featuring an ultra-simple ...
Electronic Specifier

Shortlist announced for Electronics Excellence Awards 2026

Welcome to the shortlist announcement page! Here you will find the shortlisted products for the most rigorous awards in the ...
IEEE

Gold Wire Bonding Quality Inspection of Integrated Circuit Based on Slenderness-Rotated Object Detection

Abstract: Gold wire bonding is a critical interconnection technique for integrated circuit, connecting chips to substrates and enabling communication through slender wires. Gold wires are ...