The IEEE's International Solid-State Circuit Conference in San Francisco featured an overview of next-generation ...

GaN suppliers have taken various approaches to packaging, leading to a lack of multiple footprint-compatible sources for ...

Nippon Electric Glass (NEG) is increasing its production of carrier glass for advanced memory and semiconductor packaging due ...

Summary Paragraf, a UK-based company, is revolutionizing graphene sensor production by creating scalable, customizable graphene field effect transistor (gFET) components. Unlike traditional graphene ...

A new technical paper titled “Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies” was published by researchers at Arizona State University. Abstract ...

Infineon has introduced Q-DPAK and TOLL package options to its lineup of 650-V CoolSiC Generation 2 (G2) MOSFETs. Leveraging ...

Japan Display Inc. (JDI) announced a major restructuring plan that includes ending LCD production, transitioning to OLED ...

AI-driven automation, tighter design-test collaboration, and evolving BiST techniques are redefining DFT strategies.

He has achieved significant academic success, receiving 'Best Paper Awards' at over 20 international conferences, including IEEE. Vice President Lee is a top technical expert in the semiconductor ...

Summary Belgian researchers at Imec unveiled a breakthrough at SPIE Photonics West, growing gallium arsenide lasers directly on standard silicon wafers. Their novel trench-based method confines ...

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To solve this problem, we propose an inverted packaging structure for LED display devices. The LED chips' emitting surface is mounted on the transparent carrier board (TCB) while the backside is ...