Until 2018, DRAM peripheral transistors were predominantly made in planar logic MOSFET technology with poly-Si/SiO 2 or ...

The convergence of front-end and back-end processes in advanced packaging is reshaping the industry. The semiconductor ...

To achieve ExaFLOPS computing power, it requires at least 1,000 AI chiplets interconnected by advanced high-density RDL ...

SMIC is advancing the second phase of its Beijing wafer fab, set to break ground in early 2025. The project, expected to be ...

Due to the continuous expansion of China's mature process capacity and the ongoing requests from downstream customers for ...

Despite this resilience, the earthquake may have affected between 10,000 to 20,000 wafers currently in production. These wafers are critical for TSMC's operations, particularly within its advanced ...