More and better screening of diced dies is essential to meet the quality and cost goals of the 2.5D/3D-IC era.

Semiconductor packaging plays a crucial role in modern electronics by protecting the chip, enabling electrical connections, and managing heat dissipation. As the industry moves toward miniaturization, ...

IC manufacturers have yet to fully optimize the high-volume manufacturing cost structure for the 300mm wafer size. However, the potential per-die cost savings that the larger wafer can provide is ...

Join Keysight experts for the following demonstrations featuring the latest innovations in optical transmission and data ...

Teradyne, Inc. (Nasdaq: TER) today announced it has entered into a definitive agreement to acquire privately held Quantifi Photonics, a leader in phot ...

Wafer capacity growth of 8% forecast for 2018 and 2019 versus 4.8% average yearly growth from 2012-2017. February 12, 2018 -- IC industry wafer capacity, specifically in the memory segment, was ...

Detailed price information for Aehr Test Systems (AEHR-Q) from The Globe and Mail including charting and trades.

This acquisition will enable Teradyne to deliver scalable photonic integrated circuit (PIC) test solutions. PIC technology is leveraging wafer-based manufacturing, multi-die integration ...