More and better screening of diced dies is essential to meet the quality and cost goals of the 2.5D/3D-IC era.

Lightmatter has released two pieces of technology that are aimed at speeding up the connections between AI chips.

Lightmatter, the leader in photonic (super)computing, today announced Passage™ L200, the world’s first 3D co-packaged optics (CPO) product. Designed to integrate with the latest XPU and switch silicon ...

Huawei-linked Chinese startup has developed a nearly complete suite of semiconductor manufacturing tools to enable fully domestic chip production amid escalating export controls.

Jiufengshan Laboratory (JFS) announced two major breakthroughs in GaN technology: the world's first 8-inch silicon-based ...

Upgrades to Keysight’s double-pulse test systems bring easier and even higher-accuracy measurement of dynamic characteristics ...

Teradyne, a leading provider of automated test equipment, has partnered with ficonTEC, a global leader in production solutions for photonics assembly and test, to announce the availability of the ...

Wafer shipments hit a record 8.02 million 8-inch-equivalent units in 2024, up 36.7% from the previous year. However, the average selling price (ASP) fell by 4.7% to CNY6,639, down from CNY6,967 in ...

Achieving integration of semiconducting and superconducting qubits with full industrial 300-mm wafer fabrication.

U.S. IC chemicals and materials; China export blacklist expands; global fab equipment report; high-density 3D DRAM; ...

Solar wafer prices are following a similar trajectory, with April prices projected to climb more than 3.5% month over month before dropping sharply in the third quarter as demand falls.