New Delhi, May 20, 2024 (GLOBE NEWSWIRE) -- The global wafer dicing services market stood at US$ 578.8 million in 2023. It is expected to reach US$ 838.9 million by 2032, growing at a moderate CAGR of ...
Increasing the yield of wafers is one way to attack the current global chip shortage. One possibility to reduce losses is a laser processing method called wafer stealth dicing. Here, laser power is ...
New York, May 19, 2022 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Thin Wafer Processing and Dicing Equipment Market - Growth, Trends ...
(MENAFN- EIN Presswire) Rest of Asia-Pacific segment contributed the major share in the thin wafer processing and dicing equipment market in 2021. The thin wafer processing and dicing equipment market ...
SAN JOSE — The chip industry's IC wafer fab utilization rate plunged to 72.7% of installed capacity in the second quarter from 83.8% in Q1 of this year, according to new statistics release by the ...
The global UV tapes market is poised for robust expansion through 2035, propelled by surging demand in semiconductor ...
Orbotech Ltd. (NASDAQ: ORBK) announced that it has successfully closed the previously-announced acquisition of SPTS Technologies Group Limited ("SPTS"), in a strategic move into the high growth areas ...
TOKYO--(BUSINESS WIRE)--Furukawa Electric Co., Ltd. (TOKYO:5801) has begun mass producing expand separation dicing tape, a type of tape for use with semiconductors. Expand separation dicing tape ...
SAN JOSE, Calif. – Corwil Technology Corp., a provider of contract assembly and wafer dicing services, today announced the acquisition of Disco Hi-Tec America's wafer thinning and polishing equipment ...
The supply of IC packaging production tools including polish grinders, wafer-dicing machines, and tape laminators has become severely tight, apart from delivery lead times lengthened for wire-bonding ...
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