New Delhi, May 20, 2024 (GLOBE NEWSWIRE) -- The global wafer dicing services market stood at US$ 578.8 million in 2023. It is expected to reach US$ 838.9 million by 2032, growing at a moderate CAGR of ...

New York, May 19, 2022 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Thin Wafer Processing and Dicing Equipment Market - Growth, Trends ...

The IC industry has been on a mission to pare down older capacity (i.e. ≤200mm wafers) in order to produce devices more cost-effectively on larger wafers. In its recently released Global Wafer ...

BARCELONA, Spain, Feb. 28, 2024 /PRNewswire/ -- On February 26, 2024, at the Mobile World Congress ("MWC") 2024, the largest worldwide telecommunications event, was held in Barcelona. Leading global ...

Orbotech Ltd. (NASDAQ: ORBK) announced that it has successfully closed the previously-announced acquisition of SPTS Technologies Group Limited ("SPTS"), in a strategic move into the high growth areas ...

TOKYO--(BUSINESS WIRE)--Furukawa Electric Co., Ltd. (TOKYO:5801) has begun mass producing expand separation dicing tape, a type of tape for use with semiconductors. Expand separation dicing tape ...

Synova SA is poised to revolutionize wafer dicing with its innovative laser-microjet (LMJ) technology, where a hair-thin low-pressure jet of water guides the laser while simultaneously absorbing heat ...

New York, Feb. 21, 2020 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Thin Wafer Processing and Dicing Equipment Market - Growth, Trends ...