With today's chips packing more power into smaller footprints, getting them from fab to factory now demands a new level of ...

Kurt Sievers, the CEO of Dutch semiconductor giant NXP Semiconductors, who is set to officially step down at the end of ...

Innoscience, a leading Chinese GaN specialist, plans to expand its monthly production of 8-inch (200mm) wafers from 13,000 to ...

SK hynix to reportedly change wafer cutting for its next-gen HBM4 memory and 400-layer NAND flash, as they're becoming ...

Performing wafer testing only after singulation has been an option for wafer level package products for the past 15 years. This represents a shift right in the test and assembly process flow, which ...

Over the last years, singulation of thin semiconductor wafers with (ultra) low-k top layer has become a challenge in the production process of integrated circuits. The traditional blade dicing process ...

Cumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to expand its product portfolio with the KerfAid Series, an ...

About BlackStar Laser Wafer Dicer Powered by Fantom Width Laser Dicing (FWLD) technology, the BlackStar helps maximize die yield per wafer and minimize material loss.