LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, today announced that ...

MACOM Technology Solutions Holdings Inc (NASDAQ: NASDAQ:MTSI) reported its Q1 FY2025 earnings with an adjusted EPS of $0.79, slightly surpassing the forecast of $0.78. Revenue reached $218 million, ...

ic packaging and electrical testing, wafer fabrication technology, cleanroom and vacuum technology, design engineering, design verification engineering or any other courses identified by SD&TE.

The company has made substantial headway in SiC technology, including the recent launch of the world’s first n-type 300-mm (12-inch) SiC substrate at the SemiconEurope 2024 trade fair in Munich, ...

Key Laboratory for Micro-Nano Optoelectronic Devices of Ministry of Education, School of Physics and Electronics, Hunan University, Changsha 410082, China ...

When we have this scenario, we have to consider how to test these chiplets. That means testing them at the singulated die level or at the wafer level, but also once they’re integrated into a package.

Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D ... quality,” explains Andras Vass-Varnai, 3D-IC ...