150mm and 200mm wafer fabs accounted for two-thirds of total closures. March 01, 2018 -- Since the global economic recession of 2008-2009, the IC industry has been on a mission to pare down older ...

Timely engineering fixes rely on high-speed communications standards, but data inconsistencies are getting in the way.

and amalgamation of circuits onto the wafer. The outcome is an IC wafer prepared from the congregation into electronic gadgets. Semiconductor wafers are structuring the components of the electronic ...

TSMC plans to increase its investment in Arizona, expanding its fabs to cooperate with the 'manufacture in USA' policy pushed ...

These factors reduce the overall number of wafers an IC manufacturer can process in a given time, and also raise production costs per chip. Extreme ultraviolet lithography can achieve these ...

Taiwan Semiconductor Manufacturing Company (TSMC) has reportedly implemented new shipment restrictions on Chinese IC design ...

LQDX Inc., developer of high-performance materials and process IP for advanced semiconductor packaging, today announced that ...