Intel’s answer to these advanced packaging demands is Foveros. They’ve introduced new solutions, Foveros-B and Foveros-R, ...

IBM introduced its new Power11 chips on Tuesday, marking its first major update to its "Power" line of chips since 2020 ...

This paper presents a 5-bit 1.25-GS/s folding flash ADC. The prototype achieves a folding factor of four with a capacitive folding technique that only consumes dynamic power. Incorporated with various ...

These six stocks span numerous sectors, providing investors with opportunities in both growth and dividend yield.

Google's next-gen Tensor G6 processor for its Pixel 11 smartphones will be mass produced on TSMC's new 2nm process, will fight Qualcomm, Apple, Samsung.

In this article, we propose a carbon nanotube (CNT) field-effect transistor (CNFET)-based static random access memory (SRAM) design at the 5-nm technology node that is optimized based on the tradeoff ...

By adding only the necessary GaN transistors to a silicon chip, the team achieved a balance between scalability and efficiency that could make advanced electronics more accessible and affordable.

Apple, Qualcomm, and MediaTek are reportedly set to launch two nanometer systems-on-a-chip (SOCs) in late 2026, with the new processors potentially manufactured by Taiwan Semiconductor ...

Almost one year later, IBM has announced, in a July 9, 2015 IBM news release on PRnewswire.com the accomplishment of a working 7nm test chip, An alliance led by IBM Research (NYSE: IBM) today ...

Hardware Processors New chip industry roadmap predicts true 10 nm silicon won't arrive until 2039 and yet Moore's Law is, actually, alive and kicking ...

Hardware Researchers develop a new technique to bond GaN transistors to a silicon chip, with the ultimate goal of having more powerful and efficient wireless transmitters News ...