LG Innotek is expanding its focus beyond camera module manufacturing and is preparing to venture into the field of next-generation glass substrates. The company has revealed its intention to produce ...

High-accuracy packaging in panel level packaging ~ TOKYO, JP / ACCESS Newswire / March 27, 2025 / Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter "Toray ...

However, compared to wafers, large glass panels warp significantly and are difficult to transfer, and require larger heaters ...

New Momentum for Advanced Packaging Growth. Within these major themes, the forums will facilitate in-depth discussions and ...

Interposers and substrates are undergoing a profound transformation from intermediaries to engineered platforms responsible ...

With self-developed chips Apple will reduce its dependence on third-party suppliers, thereby reducing component costs and ...

The SoP design integrates an RF chip onto a 2.66-inch e-paper display glass substrate using Realtek Semiconductor's ...

TAIPEI (Taiwan News) — E Ink announced Wednesday its partnership with Realtek to launch a low-power electronic shelf label ...

While glass substrates may not replace epoxy entirely, they offer a valuable alternative for specific applications.

The global panel-level packaging market experienced a moderate CAGR of 4.5% from 2020 to 2024, reaching USD 2.2 billion in ...

Samsung Electronics has reportedly begun developing a next-generation packaging material, the "glass interposer," a move aimed at replacing the costly silicon interposers currently used in ...