While glass substrates may not replace epoxy entirely, they offer a valuable alternative for specific applications.

However, compared to wafers, large glass panels warp significantly and are difficult to transfer, and require larger heaters ...

High-accuracy packaging in panel level packaging ~ TOKYO, JP / ACCESS Newswire / March 27, 2025 / Toray Engineering Co., Ltd. (head office: Chuo-ku, Tokyo; CEO & COO: Takashi Iwade; hereinafter "Toray ...

Saturday 8 February 2025 Samsung denies claims of boosting its glass substrate supply chain to win AI chip clients Amid intensifying competition in advanced semiconductor packaging, Samsung ...

This system is capable of packaging ... on glass panels, which is gaining attention as an alternative material to silicon, contributing to the manufacturing of next-generation semiconductor ...

SKC will showcase glass substrates at the Mobile World Congress 2025 (MWC 2025), the world's largest mobile exhibition, held from Mar. 3 to 6 (local time). SKC will display glass substrates in ...

TOKYO, JAPAN - Media OutReach Newswire - 27 March 2025 - Toray Engineering Co., Ltd.,has developed the UC5000, a high-accuracy semiconductor packaging equipment (bonder) for panel level packaging "PLP ...

Demand for advanced semiconductor foundry capacity will remain at an all-time high in 2025. Many leading industry analyst ...

and other defects specific to glass substrates. It is compatible with glass core interposers and rewiring glass carriers used in panel-level packaging (PLP) and other applications. Semiconductor ...