Abstract: Nowadays, serious lateral temperature gradient across the chip surface can significantly reduce the lifetime of the power semiconductor devices. Currently, the primary methods for extracting ...

Heterogeneous integration is more than a technical milestone—it’s a strategic enabler of the next wave of digital ...

Abstract: An adaptive nonconforming mesh refinement technique for 2-D semiconductor device simulations with the finite volume scheme on triangular meshes is proposed to enhance the numerical accuracy ...

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