Siemens Digital Industries Software has signed an OEM agreement with Alphawave Semi to bring its portfolio of high-speed interconnect silicon intellectual property (IP) to market.

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Chiplet design engineers have complex new considerations compared to PCB concepts. Maintaining the quality and reliability of electrical signals as they travel through interconnects is proving to be ...

South Korea's 8-inch wafer foundry DB HiTek reportedly has seen a significant increase in capacity utilization, thanks to demand from China.

AI-driven automation, tighter design-test collaboration, and evolving BiST techniques are redefining DFT strategies.

Dr. Patrick Heissler, CEO, SCRONA AG, discusses the company’s recently unveiled 128-nozzle electrohydrodynamic (EHD) printhead, which achieves a three-digit nozzle count in digital EHD technology for ...

market is poised for substantial growth, fueled by the increasing demand for advanced electronic devices, the rise in electric vehicle adoption</p ...

market is poised for substantial growth, fueled by increasing demand for advanced electronic devices, the rapid adoption of electric vehicles ...

SemiQ Inc. has announced its third-generation QSiC 1200V MOSFET, a silicon carbide device engineered for high-voltage ...

Learn about the digital engineering platform that the DOD intends to use to accelerate the development of integrated circuits ...

High-precision Laser Wafer Marking technologies are designed for engraving serial numbers and other critical information on silicon and compounds used in the semiconductor industry.

ASML CEO signals US advantage as China faces 10~15 year gap in advanced chip technology. Christophe Fouquet, CEO of ASML, ...