BESI targets hybrid bonding expansion with 50nm tool launch in late 2025
Revenue for Q4 2024 was €153.4 million, with a 2% sequential decline and a 3.9% drop year-over-year, due to weaker mainstream assembly markets and lower demand for hybrid bonding and photonics ...
BE Semiconductor's Hybrid Bonding Opportunity Keeps Progressing, Next Five Years Look Strong
Besi's clients still need to build their hybrid bonding installed base over the next decade. Their average selling price is several times that of previous generations, and they will also generate ...
Semiconductor Engineering13h
Energy Saving In Semiconductor Packaging Plating Processes Through Chemical Deflashing Process Optimization
Using lower temperature and no flash point chemicals to achieve comparable deflashing effectiveness without inducing ...
Semiconductor Engineering1d
Low-Temperature Solid-Liquid Interdiffusion Bonding For High-Density Interconnect Applications
A new technical paper titled “Facilitating Small-Pitch Interconnects with Low-Temperature Solid-Liquid Interdiffusion Bonding ...
siliconsemiconductor1d
EV Group highlights 'revolutionary' temporary wafer bonding and debonding solution
EV Group (EVG) is highlighting its industry-leading IR LayerRelease™ temporary bonding and debonding (TB/DB) solution, as ...