Chemical mechanical polishing (CMP) is a vital process in advanced microelectronics manufacturing that fuses chemical reactions with mechanical abrasion to achieve ultra-smooth, globally planar ...

Sherwin-Williams also said these low-VOC coatings help accelerate fab construction in two ways: Applying steel and concrete ...

The materials solutions business makes chemicals used in key, high-value manufacturing steps throughout the fab process, including photolithography, deposition, chemical mechanical planarization ...

He also teaches courses on mathematical methods for engineers (MECH 102) and engineering thermodynamics (MECH 121). Prior to coming to SCU, he worked as a process engineer in the Chemical Mechanical ...

Planarization by Cu electropolishing has many advantages, including its noncontact nature, easy endpoint detection, and minimal introduction of contamination. However, pattern sensitivity may limit ...

Chemical mechanical planarization (CMP) can enable the overall subnanometer flatness of copper to meet the needs of integrated circuits, but the slurries used in CMP still face challenges in terms of ...

Researchers in Korea have developed an artificial intelligence (AI) technology that predicts molecular properties by learning ...

Caltech professor of chemistry Sandeep Sharma and colleagues from IBM and the RIKEN Center for Computational Science in Japan ...