Capacity for 200mm wafers forecast to slip more than 10 points during same period. July 03, 2013 -- Since 2008, the majority of integrated circuit production has taken place on 300mm wafers. In terms ...

The company also announced an even more ambitious technology named System-on-Wafer (SoW) that will allow for 3D stacking of logic and memory directly on top of a 300mm wafer-sized chip.

As a result, IC industry capacity is also becoming more concentrated and this trend is especially prevalent in 300mm wafer technology. Figure 1 lists the 300mm installed capacity leaders for 2012 and ...