Capacity for 200mm wafers forecast to slip more than 10 points during same period. July 03, 2013 -- Since 2008, the majority of integrated circuit production has taken place on 300mm wafers. In terms ...

The company also announced an even more ambitious technology named System-on-Wafer (SoW) that will allow for 3D stacking of logic and memory directly on top of a 300mm wafer-sized chip.

The RFAB2 facility will more than double wafer capacity at the Richardson site. Only two of the new 300mm fabs scheduled to open in 2022 are for memory products. SK Hynix is expected to begin ...