ASE has officially launched its fifth plant in Penang, which will significantly build on the company’s strong packaging and ...

Xyztec drives innovation in bond testing As the technology leader in bond testing, xyztec continues to lead the way in innovation, redefining precision, speed, and efficiency in t ...

AblePrint Technology (APT), a supplier of pneumatic and thermal process solutions for semiconductor packaging, has reported ...

As we look toward 2025, Delphon Industries is poised to meet the evolving demands of the semiconductor industry with a focus on innovation, operational excellence, and customer collaboration. Despite ...

Focusses on Advanced IC-Substrates and Next Generation Wafer-Level Packaging ...

Multinational technology company 3M has joined the US-JOINT Consortium, a group of 12 semiconductor suppliers focused on ...

Apple has begun mass production of its next-generation M5 series chips for key products such as the next-generation Mac and ...

Source: EV Group. According to Dr. Thorsten Matthias, regional sales director Asia/Pacific for EV Group, “Accelerating the ...

The board could also decide to build capacity in the U.S. for advanced packaging, which Taiwan Semiconductor has kept in Taiwan, FT cited unnamed sources familiar with the matter. Although North ...

Taiwan's President plans to invest more in and trade more with the US, increase defense spending, and engage in discussions ...