High-precision Laser Wafer Marking technologies are designed for engraving serial numbers and other critical information on silicon and compounds used in the semiconductor industry. “By ...
A new technical paper titled “Design and Implementation of Test Infrastructure for Higher Parallel Wafer Level Testing of System-on-Chip” was published by researchers at Inha University and Teradyne. ...
Intel has run its initial lots of 18A wafers at its Arizona fab, with Fab 52 and Fab 62 pumping out Intel 18A wafers, ahead ...
Valued at over $10 million, the deal includes multiple high-power FOX-XP wafer-level test and burn-in systems ... levels from ...
The investments will focus on advanced technologies including silicon wafers, ATMP (Assembly, Testing, Marking ... focusing on advanced silicon wafer, fab, and ATMP technology.