The Government of Canada understands the importance of positioning the country as a supplier of choice for specialized semiconductor products. With applications in nearly every industry, ...

Researchers demonstrate scalable integration of graphene and GaN devices using van der Waals forces, enabling ...

Sarcina Technology's AI platform can create advanced AI packaging solutions tailored to meet customised requirements.

When materials are created on a nanometer scale—just a handful of atoms thick—even the thermal energy present at room ...

The team led by Delphine Bouilly, a professor in UdeM's Physics Department and director of IRIC's Electronic Nanobiosensor ...

Leveraging ASE’s FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembly technology, this platform includes an interposer which supports chiplets using UCIe-A for die-to-die interconnects, allowing ...

TSMC's cutting-edge 2nm chips to see monthly production capacity of up to 80,000 wafers before the end of the year, Apple ...

The Global Semiconductor Wafer market is projected to grow significantly, from 24,362.2 million in 2025 to 42,987.0 million ...

Sarcina Technology, a global semiconductor packaging specialist, has launched its AI platform to enable advanced AI packaging ...

SiBionics announced today that it unveiled its GS3 continuous glucose monitor (CGM), which now has CE mark approval.

This close cousin of the wafer-thin X820 steps down to a 1.3 megapixel camera, but adds a memory card slot and GSM 850. Other features include stereo Bluetooth and EDGE data.